In the world of modern technology, sensor integration is key to innovation. Increasingly, sensors are supplied as bare chips, offering manufacturers the flexibility to produce these components on a large scale. However, the challenge lies in further integration: from simple housings to complex, custom modules for specific applications.

Egbert Stellinga (Product Marketing Manager) and Rob Kuijpers (Product Manager) discuss the six levels of sensor integration, ranging from bare chip to fully integrated module. Due to the growing need for compact, accurate solutions, sensor integration is becoming increasingly important for efficient and innovative technological developments. 

Read it full article on the High-Tech Systems website…

This article appeared in High-Tech Systems and was written by Hans van Eerden

ASML turns 40 in 2024! Reason enough for Bits&Chips to release an ASML special. Since Sentech has been supplying sensor solutions to ASML since its inception, a contribution from us (written in co-creation with ASML) is of course essential.

For various sensor challenges, Mario Creemers, Component Engineer/Manager relies on Sentech, a supplier to ASML since its inception in 2000. “They are innovative and solution-oriented. For sensor-based assemblies, I've come to consider them a co-creator.”

Over the years, Sentech has delivered many sensor solutions to ASML. Account Manager Peter Verstappen: “We have built sensor assemblies for all systems, from the PAS 5500 to the latest EXE EUV machine.”.

Read the full article here: https://hubs.ly/Q02d9q3m0